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2905 results:
  • 2771. Anmeldeformular_IA_2015_01.pdf
    Date: 07.12.2017
    Formular drucken Anmeldung zur Eignungsprüfung Innenarchitektur Antrag auf Teilnahme an der Eignungsprüfung gemäß § 4 der Eignungsprüfungsordnung Persönliche Daten Familienname: Vorname: Geburtsname: Geburtsdatum: Staatsangehörigkeit: Geburtsort: Geburtsland: Anschrift Straße/Nr.: PLZ/Ort: Telefon/Mobiltel.: E-Mail: Erststudium: Ja Nein Da
  • 2772. Anleitung_PIN_englisch.pdf
    Date: 23.09.2026
    How do I get a PIN? 1. Log in to the Discovery system: https://hbzhkl.primo.exlibrisgroup.com/discovery/search?vid=49HBZ_HKL:VU1&lang=en If you don't have a password yet: • In the login dialog, click the “Passwort vergeben” link to set up a password for your library account • Your User ID is the barcode number on the back of your CampusCard. Al
  • 2773. Anlage_1_AUSLANDSAUFENTHALT.pdf
    Date: 19.07.2024
    Anlage 1 / Auslandsaufenthalt Annex No. 1 / Stay Abroad Registration Form -------------------------------------------------------------------------------------------------------------------------------------Name, Vorname : ………………………………………………………………………. Matrikel-Nr. : ………………………………………………………………………. Staat : …………………………………… Monate : …………………………
  • Bachelorstudiengänge im Fachbereich AING Nachweis über das Vorpraktikum An der HS KL im Studiengang: ...........................................................seit: ........................... Geschlecht: männlich weiblich divers Geburtsjahr: ................ Name: ............................................... Vorname: ..................
  • Alle Studiengänge AING Anrechnung von im Ausland erworbenen Prüfungs- und Studienleistungen Name: Vorname: Geb.-Datum: Matr. Nr.: Stdg.: ______________________________ _________________________________ _____________________ _____________ __________________ Gasthochschule: Fachbereich/Department: Stadt, Land: Semester: _______________
  • Damascene copper electroplating for chip interconnections by P. C. Andricacos C. Uzoh J. 0. Dukovic J. Horkans H. Deligianni zyxwvutsrqponmlkjihgfedcbaZYXWVUTSRQPONMLKJIHGFED zyxw zyxwvut zyxwvutsr Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 199Os, has been central to IBM's Cu chip interc
  • 2777. Analytics and microscopy
    Date: 13.09.2023
    Microscopes Reflected light microscope (Zeiss Axioplan 2) Confocal microscope (Zeiss Smartproof 5) Stereo microscope (Olympus special setup) Digital microscope (Olympus DSX 1000) 3D laser scanning microscope (Olympus LEXT OLS5100) Magneto-optical Kerr microscope (Evico Magnetics) Scanning electron microscope (TESCAN Clara Mark III)
  • 2778. Analytics and microscopy
    Date: 28.06.2025
    Microscopes Reflected light microscope (Zeiss Axioplan 2) Confocal microscope (Zeiss Smartproof 5) Stereo microscope (Olympus special setup) Digital microscope (Olympus DSX 1000) 3D laser scanning microscope (Olympus LEXT OLS5100) Magneto-optical Kerr microscope (Evico Magnetics) Scanning electron microscope (TESCAN Clara Mark III)
  • 2779. Alumni - Alumni
    Date: 18.09.2024
    Alumni Welcome to the Hochschule Kaiserslautern’s alumni page The Hochschule Kaiserslautern wishes to offer all graduates a forum that allows them to stay in contact with the university, meet new contacts, exchange specialist knowledge, initiate projects with like-minded individuals, or to simply get back in touch with former classmates in a con
  • 2780. Alumni
    Date: 19.11.2024
    Contact Alumni Welcome to the Hochschule Kaiserslautern’s alumni page The Hochschule Kaiserslautern wishes to offer all graduates a forum that allows them to stay in contact with the university, meet new contacts, exchange specialist knowledge, initiate projects with like-minded individuals, or to simply get back in touch with former classm
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