Veröffentlichungen/Patente

Dissertation

[1]    S. Braun, Wafer-level heterogeneous integration of MEMS actuators. PhD thesis, KTH, Microsystem Technology, 2010. QC20100729.

Basierend auf folgenden Journal Publikation

[2]    S. Haasl, S. Braun, A. S. Ridgeway, S. Sadoon, W. van der Wijngaart, and G. Stemme, “Out-of-plane knife gate microvalves for controlling large gas flows,” Journal of microelectromechanical systems, vol. 15, no. 5, pp. 1281–1288, 2006. QC20100727.

[3]    S. Braun, N. Sandström, G. Stemme, and W. van der Wijngaart, “Wafer-scale manufacturing of bulk shape-memory-alloy microactuators based on adhesive bonding of titanium-nickel sheets to structured silicon wafers,”  Journal of microelectromechanical systems, vol. 18, no. 6, pp. 1309–1317, 2009. QC20100727.

[4]    D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, and W. van der Wijngaart, “Design and wafer-level fabrication of SMA wire microactuators on silicon,” Journal of microelectromechanical systems, vol. 19, no. 4, pp. 982–991, 2010. QC 20100729 Uppdaterad från accepted till published (20110217).

[5]    H. Gradin, S. Braun, G. Stemme, and W. van der Wijngaart, “Localized removal of the Au-Si eutectic bonding layer for the selective release of microstructures,” Journal of Micromechanics and Microengineering, vol. 19, no. 10, pp. 105014–105023, 2009. QC20100729.

[6]    S. Braun, J. Oberhammer, and G. Stemme, “Single-chip MEMS 5x5 and 20x20 double-pole single-throw switch arrays for automating telecommunication networks,” Journal of Micromechanics and Microengineering, vol. 18, no. 1, pp. 015014–, 2008. QC 20100729.

[7]    S. Braun, J. Oberhammer, and G. Stemme, “Row/column addressing scheme for large electrostatic actuator MEMS switch arrays and optimization of the operational reliability by statistical analysis,” Journal of microelectromechanical systems, vol. 17, no. 5, pp. 1104–1113, 2008. QC 20100729.

Spätere Journal Publikationen

[8]    A. C. Fischer, H. Gradin, S. Schröder, S. Braun, G. Stemme, W. van der Wijngaart, and F. Niklaus, “Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates,” Journal of Micromechanics and Microengineering, vol. 22, no. 5, pp. 055025–, 2012. QC 20120528.

[9]    H. Gradin, S. Braun, G. Stemme, and W. v. d. Wijngaart, “SMA microvalves for very large gas flow control manufactured using wafer-level eutectic bonding,” IEEE transactions on industrial electronics (1982. Print), vol. 59, no. 12, pp. 4895–4906, 2012. QC 20120806.

[10]    H. Gradin, D. Clausi, S. Braun, G. Stemme, J. Peirs, W. van der Wijngaart, and D. Reynaerts, “A low-power high-flow shape memory alloy wire gas microvalve,” Journal of Micromechanics and Microengineering, vol. 22, no. 7, p. 075002, 2012.

[11]    H. Gradin, S. Bushra, S. Braun, G. Stemme, and W. van der Wijngaart, “Wafer-level integration of NiTi shape memory alloy on silicon using Au-Si eutectic bonding,” Journal of Micromechanics and Microengineering, vol. 23, no. 1, pp. 015008–, 2013. QC 20130110. Updated from accepted to published.

[12]    D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, and W. van der Wijngaart, “Robust actuation of silicon MEMS using SMA wires integrated at wafer-level by nickel electroplating,” Sensors and Actuators A-Physical, vol. 189, pp. 108–116, 2013. QC 20130205. Updated from submitted to published.

Konferenzbeiträge

[13]    S. Braun, S. Haasl, S. Sadoon, A. S. Ridgeway, W. van der Wijngaart, and G. Stemme, “Small footprint knife gate microvalves for large flow control,” in Transducers ’05, Digest of Technical Papers, Vols 1 and 2, pp. 329–332, IEEE, 2005. QC 20101005.

[14]    S. Braun, J. Oberhammer, and G. Stemme, “Mems single-chip microswitch array for re-configuration of telecommunication networks,” in 2006 European Microwave Conference : Vols 1-4, pp. 315–318, IEEE, 2006. QC 20100629.

[15]    S. Braun, T. Grund, S. Ingvarsdottir, M. Kohl, W. van der Wijngaart, and G. Stemme, “Robust trimorph bulk SMA microactuators for batch manufacturing and integration,” in TRANSDUCERS and EUROSENSORS ’07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems :, pp. 2191–2194, IEEE, 2007. QC 20101011.

[16]    S. Braun, J. Oberhammer, and G. Stemme, “MEMS single-chip 5x5 and 20x20 double-switch arrays for telecommunication networks,” in IEEE 20th International Conference on Micro Electro Mechanical Systems, 2007. MEMS:, Proceedings: IEEE Micro Electro Mechanical Systems, pp. 811–814, IEEE, 2007. QC 20141208.

[17]    S. Braun, J. Oberhammer, and G. Stemme, “Smart individual switch addressing of 5x5 and 20x20 MEMS double-switch arrays,” in TRANSDUCERS and EUROSENSORS ’07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems :, pp. 153–156, IEEE, 2007. QC 20141208

[18]    N. Sandström, S. Braun, T. Grund, G. Stemme, M. Kohl, and W. van der Wijngaart, “Wafer-scale manufacturing of robust trimorph bulk SMA microactuators,” in ACTUATOR 08, CONFERENCE PROCEEDINGS, pp. 382–385, 2008. QC 20110203.

[19]    S. Braun, J. Oberhammer, and G. Stemme, “MEMS crossbar switches for telecommunication networks,” 2008. QC 20111130.

[20]    H. Gradin, S. Braun, M. Sterner, G. Stemme, and W. van der Wijngaart, “Selective electrochemical release etching of eutectically bonded microstructures,” in TRANSDUCERS 2009 : 15th International Conference on Solid-State Sensors, vol. Actuators and Microsystems, pp. 743–746, 2009. QC 20101022.

[21]    N. Sandström, S. Braun, G. Stemme, and W. van der Wijngaart, “Full wafer integration of shape memory alloy microactuators using adhesive bonding,” in TRANSDUCERS 2009 : 15th International Conference on Solid-State Sensors, vol. Actuators and Microsystems, pp. 845–848, 2009. QC 20101022.

[22]    D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, and W. van der Wijngaart, “Microactuation utilizing wafer-level integrated SMA wires,” in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, no. MEMS, pp. 1067–1070, 2009. QC 20101020.

[23]    A. C. Fischer, H. Gradin, S. Braun, S. Schröder, G. Stemme, and F. Niklaus, “Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology,” in 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011 IEEE, Proceedings: IEEE micro electro mechanical systems, pp. 348–351, IEEE, 2011.

[24]    D. Clausi, H. Gradin, S. Braun, J. Peirs, G. Stemme, D. Reynaerts, and W. van der Wijngaart, “Wafer-level mechanical and electrical integration of SMA wires to silicon mems using electroplating,” in 24th IEEE International Conference on Micro Electro Mechanical Systems, pp. 1281–1284, IEEE, 2011. QC 20111109.

[25]    H. Gradin, S. Braun, G. Stemme, and W. v. d. Wijngaart, “A wafer-level, heterogeneously integrated, high flow SMA-silicon gas microvalve,” in  Proceedings IEEE International Conference on Solid-State Sensors, Actuators,and Microsystems (Transducers), pp. 1781–1784, IEEE, 2011. QC 20111117.

[26]    D. Clausi, H. Gradin, J. Peirs, S. Braun, R. Donose, G. Stemme, W. van der Wijngaart, and D. Reynaerts, “Reliability of silicon spring-biased SMA microactuators,” 2012. QC 20130108.

Patent

[27]    S. Braun, F. Niklaus, A. Fischer, and H. Gradin, “Method for the wafer-level integration of shape memory alloy wires” European Patent Application 2011843548, US Patent US9054224B2, Australia Patent 2011332334, Canada Patent 2818301, WO 2012071003 A1